Transcend MTE MTE710T 512 GB Solid State Drive - M.2 2280 Internal - PCI Express NVMe (PCI Express NVMe 4.0 x4)

Transcend's M.2 SSD MTE710T features the PCI Express (PCIe) Gen 4 x4 interface and is compatible with NVM Express (NVMe) 1.4 specifications to achieve never-before-seen transfer speeds. The MTE710T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE710T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20?~75?.

Transcend also offers the MTE710T-I with wide temperature (-40? ~ 85?) capabilities to ensure sustained functionality and optimal reliability.

Technologies

• 112-layer 3D NAND Flash

• 30µ" PCB Gold Finger

• Corner Bond

• Extended Temperature

• Wide Temperature

• Dynamic Thermal Throttling

• Thermal Sensor

• Read Disturbance

• Garbage Collection

• Wear Leveling

• TRIM

• Bad Block Management

• Early Move

Firmware Features

• Supports NVM command

• SLC caching technology

• Dynamic thermal throttling

• Built-in LDPC ECC (Error Correction Code) functionality

• Advanced Global Wear-Leveling and Block management for reliability

• Advanced Garbage Collection

• Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices

• TRIM command for better performance

• Full drive encryption with Advanced Encryption Standard (AES) (optional)

Hardware Features

• Compliant with RoHS 2.0 standards

• Compliant with PCI Express specification 3.1

• Compliant with NVM Express specification 1.4

• Space-saving M.2 form factor (80mm) - ideal for mobile computing devices

• PCIe Gen 4 x4 interface

• DDR4 DRAM Cache embedded

• Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed

• Key components fortified by default with Corner Bond technology

• 30µ" PCB gold finger

• Promised operational reliability in a wide temperature range (from -40°C to 85°C)

• Promised operational reliability in an extended temperature range (from -20°C to 75°C)

• Supports Transcend Scope Pro software